SEMI: Global 300mm Fab Equipment Spending to Reach $149 Billion in 2026, $227 Billion by 2029

Global capital spending on 12-inch wafer manufacturing is entering a new upcycle, according to SEMI’s latest 300mm Fab Outlook report.

SEMI expects worldwide 300mm front-end fab equipment spending to reach $149 billion in 2026, a 31% year-on-year increase, and to maintain double-digit growth in the following years, climbing to $227 billion by 2029.

Capacity construction is moving in parallel. Excluding pure R&D facilities, SEMI forecasts 20 new 300mm fabs or lines to begin construction worldwide in 2026, followed by 18 in 2027. In terms of production ramp, 13 new 300mm fabs or lines are expected to start first wafer output in 2026, rising to 23 in 2027.

Fab construction spending is projected to grow 23% year on year to $47.5 billion in 2026, then 33% to $63.3 billion in 2027 and $68.4 billion in 2028. Investment is concentrated in advanced logic and memory chips.

By region, 300mm equipment investment in the Americas is expected to more than double from $18.1 billion in 2026 to $40.6 billion in 2029, reflecting the global push toward localizing semiconductor supply chains.

For CMP materials and consumables, the shift of fabs from construction to volume production means demand for high-frequency consumables such as polishing pads and slurries will grow in step with capacity release.

Data source: SEMI 300mm Fab Outlook