SiC CMP Equipment Market Projected to Grow at 19.6% CAGR

As demand for silicon carbide (SiC) power devices continues to rise across new energy vehicles, photovoltaics and industrial power supplies, SiC wafer manufacturing is becoming increasingly important. Chemical mechanical polishing (CMP) is a key step in SiC wafer processing, directly determining wafer surface planarity and device yield. Market research shows the SiC CMP equipment market is expected to grow at a compound annual growth rate (CAGR) of about 19.6%. To meet the stringent surface-quality requirements of advanced processes, equipment makers are accelerating their efforts in advanced CMP technologies, automation systems and high-precision polishing solutions to improve capacity and process stability. For suppliers of CMP consumables such as polishing pads and slurries, the ramp-up of SiC substrates opens up new incremental market opportunities.