Welcome to PlanarX (Su zhou) Technology Co., Ltd. At the heart of our operations is a commitment to pioneering our self-developed polishing pads and conditioners in the Chinese market. We stand as a symbol of technological innovation and a pledge to national development and increasing international competitiveness.
Our mission is to become a leader in technology in China, driving forward the semiconductor industry. We do more than just supply products; we deliver innovative solutions designed to enhance processes, reduce costs, and achieve excellence.
At PlanarX, we foster a culture of teamwork and personal development, creating an environment brimming with energy and innovation. We believe that through our united efforts, we can realize our shared vision, creating greater value for our clients and society.
Join us to be a part of this exciting journey of technological progress, and let's collaborate to build a more efficient and reliable future.
Responsibilities
1. Operate CNC machining for CMP polishing pads and related precision components, including programming, cutting, and quality inspection.
2. Lead polishing pad surface groove cutting—develop and execute machining programs to meet depth, width, pitch, and surface quality specifications.
3. Develop machining plans from drawings and process requirements; optimize tool paths, feed rates, and cutting parameters for consistency and yield improvement.
4. Perform daily CNC equipment inspection, maintenance, and troubleshooting; collaborate with process and QA teams on new product introduction and stable mass production.
5. Maintain machining programs, process records, and inspection data to support prototyping and continuous improvement.
Requirements
1. Associate degree or above in Mechanical, Mechatronics, or CNC-related field.
2. Solid hands-on CNC experience (3+ years) in precision machining; prior experience with polishing pad groove cutting, or similar precision grooving on soft/polymer materials, is strongly preferred.
3. Proficient in common CNC systems and programming; able to read engineering drawings and use calipers, microscopes, and other inspection tools.
4. Detail-oriented with a strong quality mindset; good communication and teamwork skills.
Compensation & Benefits
• Competitive salary (negotiable based on experience)
• Social insurance, paid leave, and holiday benefits
• Exposure to semiconductor CMP critical material manufacturing with strong technical growth opportunities
Responsibilities
1. Develop market promotion and sales strategies for CMP-related products (polishing pads, conditioners, etc.).
2. Gain in-depth understanding of customer needs; develop customized solutions and collaborate closely with R&D and technical teams to provide professional technical support.
3. Maintain and expand existing customer relationships; actively develop new markets and customers to increase product market share.
4. Analyze market trends and competitive landscape; adjust sales strategies in a timely manner to maintain competitive advantage in the CMP field.
5. Coordinate cross-departmental resources; drive project implementation and continuously improve customer satisfaction.
Requirements
1. Full-time bachelor’s degree or above.
2. 3+ years of CMP-related sales experience with proven market development and customer management capabilities.
3. Familiar with CMP processes and products; experience selling polishing pads, conditioners, or similar products preferred.
4. Excellent communication and negotiation skills; ability to build long-term relationships with customers at all levels.
5. Self-motivated with a results-oriented mindset; ability to independently achieve sales targets.
Compensation & Benefits
• Competitive salary (negotiable based on experience)
• Social insurance, paid leave, and holiday benefits
• Participation in semiconductor CMP critical material market development with strong career growth opportunities
The Field Service Engineer is responsible for on-site evaluation, testing, and analysis of polishing pads and conditioners, primarily serving integrated circuit (IC) manufacturing companies. This role works closely with CMP process engineers to evaluate and optimize polishing processes, resolve customer process issues, and ensure our polishing pads and conditioners meet or exceed customer expectations through process optimization.
Responsibilities
• Conduct on-site evaluation, testing, and analysis of polishing pads and conditioners; collect product usage data and process parameters.
• Work closely with customer CMP process engineers to evaluate and optimize polishing processes; resolve practical issues in CMP planarization processes.
• Optimize polishing pad and conditioner performance through process parameter adjustments to meet or exceed customer expectations.
• Maintain strong customer relationships; develop in-depth understanding of customer technical needs and pain points; provide timely feedback.
• Communicate customer requirements to the sales team and product managers; collaborate to provide technical solutions.
• Prepare product test reports and process analysis documentation; provide on-site feedback for product improvement and iteration.
• Provide support to global teams through email and international travel as required.
• Attend and complete all assigned technical training.
Requirements
• Technical, engineering, or scientific degree, or equivalent CMP-related field experience.
• 3-5 years of semiconductor or CMP-related field service or process experience.
• Familiarity with CMP polishing processes, polishing pad and conditioner characteristics and evaluation methods.
• Ability to analyze process data and solve problems; capable of independent process evaluation and optimization.
• Ability to work both independently and as a team while communicating effectively with internal and external customers.
• Strong communication skills; English fluency is a significant plus.
• Valid passport and ability to obtain visas for international travel.
• Valid driver’s license required.
Compensation & Benefits
• Competitive salary (negotiable based on experience)
• Social insurance, paid leave, and holiday benefits
• Exposure to semiconductor CMP critical material application and process engineering with strong technical growth opportunities